9 search results - page 1 / 2 » Techniques for Multicore Thermal Management: Classification ... |
ISCA
2006
IEEE
13 years 4 months ago
2006
IEEE
Power density continues to increase exponentially with each new technology generation, posing a major challenge for thermal management in modern processors. Much past work has exa...
APPT
2009
Springer
13 years 11 months ago
2009
Springer
Abstract. With more cores integrated into one single chip, the overall power consumption from the multiple concurrent running programs increases dramatically in a CMP processor whi...
DAC
2008
ACM
14 years 5 months ago
2008
ACM
Achieving high performance under a peak temperature limit is a first-order concern for VLSI designers. This paper presents a new model of a thermally-managed system, where a stoch...
GLVLSI
2006
IEEE
13 years 10 months ago
2006
IEEE
Reliability has become a significant challenge for system design in new process technologies. Higher integration levels dramatically increase power densities, which leads to high...
DATE
2007
IEEE
13 years 11 months ago
2007
IEEE
In deep submicron circuits, elevation in temperatures has brought new challenges in reliability, timing, performance, cooling costs and leakage power. Conventional thermal managem...