Thermal hot spots and temperature gradients on the die need to be minimized to manufacture reliable systems while meeting energy and performance constraints. In this work, we solve...
Many years of CMOS technology scaling have resulted in increased power densities and higher core temperatures. Power and temperature concerns are now considered to be a primary cha...
Daniel C. Vanderster, Amirali Baniasadi, Nikitas J...
Temperature affects not only the reliability but also the performance, power, and cost of the embedded system. This paper proposes a thermal-aware task allocation and scheduling a...
We study the problem of scheduling repetitive real-time tasks with the Earliest Deadline First (EDF) policy that can guarantee the given maximal temperature constraint. We show th...