27 search results - page 1 / 6 » Temperature-aware routing in 3D ICs |
ASPDAC
2012
ACM
12 years 1 months ago
2012
ACM
— In this paper, we present an obstacle-aware clock tree synthesis method for through-silicon-via (TSV)-based 3D ICs. A unique aspect of this problem lies in the fact that variou...
ASPDAC
2012
ACM
12 years 1 months ago
2012
ACM
— Since re-designing and re-optimizing existing logic, memory, and IP blocks in a 3D fashion significantly increases design cost, nearterm three-dimensional integrated circuit (...
GLVLSI
2009
IEEE
13 years 3 months ago
2009
IEEE
Distributing power and ground to a vertically integrated system is a complex and difficult task. Interplane communication and power delivery are achieved by through silicon vias (...
DAC
2012
ACM
11 years 8 months ago
2012
ACM
In this paper, we propose two methods used in 3D IC placement that effectively exploit the die-to-die thermal coupling in the stack. First, TSVs are spread on each die to reduce t...
ICCAD
2009
IEEE
13 years 3 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...