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» The scaling of interconnect buffer needs
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DAC
2008
ACM
14 years 6 months ago
An integrated nonlinear placement framework with congestion and porosity aware buffer planning
Due to skewed scaling of interconnect delay and cell delay with technology scaling, modern VLSI timing closure requires use of extensive buffer insertion. Inserting a large number...
Tung-Chieh Chen, Ashutosh Chakraborty, David Z. Pa...
ISQED
2002
IEEE
72views Hardware» more  ISQED 2002»
13 years 10 months ago
Inductance Aware Interconnect Scaling
This paper introduces a new global-tier interconnect scaling scheme which ensures that inductance effects do not start dominating the overall interconnect performance. It is shown...
Kaustav Banerjee, Amit Mehrotra
ASPDAC
2005
ACM
107views Hardware» more  ASPDAC 2005»
13 years 7 months ago
Making fast buffer insertion even faster via approximation techniques
Abstract— As technology scales to 0.13 micron and below, designs are requiring buffers to be inserted on interconnects of even moderate length for both critical paths and fixing...
Zhuo Li, Cliff C. N. Sze, Charles J. Alpert, Jiang...
TVLSI
2002
144views more  TVLSI 2002»
13 years 5 months ago
On-chip inductance cons and pros
Abstract--This paper provides a high level survey of the increasing effects of on-chip inductance. These effects are classified into desirable and nondesirable effects. Among the u...
Yehea I. Ismail