Due to skewed scaling of interconnect delay and cell delay with technology scaling, modern VLSI timing closure requires use of extensive buffer insertion. Inserting a large number...
Tung-Chieh Chen, Ashutosh Chakraborty, David Z. Pa...
This paper introduces a new global-tier interconnect scaling scheme which ensures that inductance effects do not start dominating the overall interconnect performance. It is shown...
Abstract— As technology scales to 0.13 micron and below, designs are requiring buffers to be inserted on interconnects of even moderate length for both critical paths and fixing...
Zhuo Li, Cliff C. N. Sze, Charles J. Alpert, Jiang...
Abstract--This paper provides a high level survey of the increasing effects of on-chip inductance. These effects are classified into desirable and nondesirable effects. Among the u...