New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
With the growing complexity in consumer embedded products and the improvements in process technology, Multi-Processor SystemOn-Chip (MPSoC) architectures have become widespread. T...
David Atienza, Pablo Garcia Del Valle, Giacomo Pac...
Three-dimensional integrated circuits (3D ICs) provide an attractive solution for improving circuit performance. Such solutions must be embedded in an electrothermally-conscious d...
The existing work on via-stapling in 3D integrated circuits optimizes power and thermal integrity separately and uses steadystate thermal analysis. This paper presents the first ...