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ICCAD
2006
IEEE
149views Hardware» more  ICCAD 2006»
14 years 1 months ago
Thermal sensor allocation and placement for reconfigurable systems
Temperature monitoring using thermal sensors is an essential tool for evaluating the thermal behavior and sustaining the reliable operation in high-performance and high-power syst...
Rajarshi Mukherjee, Somsubhra Mondal, Seda Ogrenci...
DAC
2006
ACM
14 years 5 months ago
Systematic temperature sensor allocation and placement for microprocessors
Modern high performance processors employ advanced techniques for thermal management, which rely on accurate readings of on-die thermal sensors. As the importance of thermal effec...
Rajarshi Mukherjee, Seda Ogrenci Memik
ERSA
2006
113views Hardware» more  ERSA 2006»
13 years 6 months ago
A Sensor Distribution Algorithm for FPGAs with Minimal Dynamic Reconfiguration Overhead
Thermal monitoring of a design plays a vital role to ensure safe and reliable thermal operating conditions. Thermal monitoring by employing thermal sensors is a popular technique ...
Rajarshi Mukherjee, Somsubhra Mondal, Seda Ogrenci...
ISCAS
2006
IEEE
112views Hardware» more  ISCAS 2006»
13 years 11 months ago
Fine-grain thermal profiling and sensor insertion for FPGAs
– Increasing logic densities and clock frequencies on FPGAs lead to rapid increase in power density, which translates to higher on-chip temperature. In this paper, we investigate...
Somsubhra Mondal, Rajarshi Mukherjee, Seda Ogrenci...
ISLPED
2010
ACM
181views Hardware» more  ISLPED 2010»
13 years 3 months ago
Exploiting power budgeting in thermal-aware dynamic placement for reconfigurable systems
 In this paper, a novel thermal-aware dynamic placement planner for reconfigurable systems is presented, which targets transient temperature reduction. Rather than solving time-...
Shahin Golshan, Eli Bozorgzadeh, Benjamin Carri&oa...