16 search results - page 2 / 4 » Thermal sensor allocation and placement for reconfigurable s... |
GLVLSI
2008
IEEE
13 years 6 months ago
2008
IEEE
The main contribution of this work is an analytical model for finding the upper bound on the temperature difference among various locations on the die. The proposed model can be u...
DAC
2009
ACM
14 years 6 months ago
2009
ACM
Elevated chip temperatures are true limiters to the scalability of computing systems. Excessive runtime thermal variations compromise the performance and reliability of integrated...
ISPD
2010
ACM
14 years 9 days ago
2010
ACM
Thermal/power issues have become increasingly important with more and more transistors being put on a single chip. Many dynamic thermal/power management techniques have been propo...
IEAAIE
2010
Springer
13 years 3 months ago
2010
Springer
It is desirable to ensure that the thermal comfort conditions in offices are in line with the preferences of occupants. Controlling their offices correctly therefore requires the c...
FPGA
2010
ACM
14 years 2 months ago
2010
ACM
Electronic systems increasingly suffer from component variation, thermal hotspots, uneven wearout, and other subtle physical phenomena. Systems based on FPGAs have unique opportun...