52 search results - page 1 / 11 » Three-Dimensional Layers of Maxima |
ALGORITHMICA
2004
13 years 4 months ago
2004
Abstract. We present an O(n log n)-time algorithm to solve the threedimensional layers-of-maxima problem, an improvement over the prior O(n log n log log n)-time solution. A previo...
ISVLSI
2003
IEEE
13 years 10 months ago
2003
IEEE
Three-dimensional integration technologies have been proposed in order to mitigate design challenges posed by deep-submicron interconnect. By providing multiple layers of active d...
IJCNN
2000
IEEE
13 years 9 months ago
2000
IEEE
: The main purpose of this work is to create a physiologically realistic computational model of the retina by providing a flexible, real-valued three-dimensional architecture. This...
ICCD
2005
IEEE
14 years 1 months ago
2005
IEEE
As technology scales, interconnects dominate the performance and power behavior of deep submicron designs. Three-dimensional integrated circuits (3D ICs) have been proposed as a w...
ISQED
2002
IEEE
13 years 9 months ago
2002
IEEE
In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit ar...