Sciweavers

435 search results - page 87 / 87
» Timing analysis of asynchronous circuits using timed automat...
Sort
View
DAC
1997
ACM
13 years 10 months ago
Electronic Component Information Exchange (ECIX)
A number of industry trends are shaping the requirements for IC and electronic equipment design. The density and complexity of circuit technologies have increased to a point where...
Donald R. Cottrell
ISPD
2006
ACM
175views Hardware» more  ISPD 2006»
13 years 11 months ago
mPL6: enhanced multilevel mixed-size placement
The multilevel placement package mPL6 combines improved implementations of the global placer mPL5 (ISPD05) and the XDP legalizer and detailed placer (ASPDAC06). It consistently pr...
Tony F. Chan, Jason Cong, Joseph R. Shinnerl, Kent...
CODES
2005
IEEE
13 years 11 months ago
Power-smart system-on-chip architecture for embedded cryptosystems
In embedded cryptosystems, sensitive information can leak via timing, power, and electromagnetic channels. We introduce a novel power-smart system-on-chip architecture that provid...
Radu Muresan, Haleh Vahedi, Y. Zhanrong, Stefano G...
ICCAD
1999
IEEE
88views Hardware» more  ICCAD 1999»
13 years 10 months ago
Performance optimization under rise and fall parameters
Typically,cell parameterssuch as the pin-to-pinintrinsicdelays, load-dependentcoe cients,andinputpin capacitanceshavedifferent values for rising and falling signals. The performan...
Rajeev Murgai
ISLPED
2007
ACM
169views Hardware» more  ISLPED 2007»
13 years 7 months ago
Throughput of multi-core processors under thermal constraints
We analyze the effect of thermal constraints on the performance and power of multi-core processors. We propose system-level power and thermal models, and derive expressions for (a...
Ravishankar Rao, Sarma B. K. Vrudhula, Chaitali Ch...