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DAC
2008
ACM
14 years 6 months ago
Topological routing to maximize routability for package substrate
Compared with on-chip routers, the existing commercial tools for off-chip routing have a much lower routability and often result in a large number of unrouted nets for manual rout...
Shenghua Liu, Guoqiang Chen, Tom Tong Jing, Lei He...
ASPDAC
1999
ACM
116views Hardware» more  ASPDAC 1999»
13 years 9 months ago
An Automatic Router for the Pin Grid Array Package
A Pin-Grid-Array (PGA) package router is presented in this paper. Given a chip cavity with a number of I/O pads around its boundary and an equivalent number of pins distributed on...
Shuenn-Shi Chen, Jong-Jang Chen, Sao-Jie Chen, Chi...
ICCAD
2006
IEEE
113views Hardware» more  ICCAD 2006»
14 years 1 months ago
Layer minimization of escape routing in area array packaging
We devise a central triangular sequence to minimize the escape routing layers in area array packaging. We use a network flow model to analyze the bottleneck of the routable pins. ...
Renshen Wang, Rui Shi, Chung-Kuan Cheng
NCA
2007
IEEE
13 years 11 months ago
A Topological Analysis of Monitor Placement
The Internet is an extremely complex system, and it is essential that we be able to make accurate measurements in order to understand its underlying behavior or to detect improper...
Alden W. Jackson, Walter C. Milliken, Cesar A. San...
ASPDAC
2004
ACM
93views Hardware» more  ASPDAC 2004»
13 years 10 months ago
Layer assignment for reliable system-on-package
—The routing environment for the new emerging mixed-signal System-on-Package (SOP) technology is more advanced than that of the conventional PCB or MCM technology – pins are lo...
Jacob R. Minz, Sung Kyu Lim