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DAC
2008
ACM

Topological routing to maximize routability for package substrate

9 years 3 months ago
Topological routing to maximize routability for package substrate
Compared with on-chip routers, the existing commercial tools for off-chip routing have a much lower routability and often result in a large number of unrouted nets for manual routing. In this paper, we develop an effective, yet efficient, substrate routing algorithm, applying dynamic pushing to alleviate the net ordering problem and reordering and rerouting for further wire length and congestion reduction. Compared with an industrial design tool that leaves 936 nets unrouted for nine industrial designs with a total of 6100 nets, our algorithm reduces the unrouted nets to 212, a 4.5-times net number reduction and practically more design time reduction. Categories and Subject Descriptors B.7.2 [Design Aids]: Placement and routing General Terms Algorithms, Experimentation Keywords IC package, substrate routing, system in package
Shenghua Liu, Guoqiang Chen, Tom Tong Jing, Lei He
Added 12 Nov 2009
Updated 12 Nov 2009
Type Conference
Year 2008
Where DAC
Authors Shenghua Liu, Guoqiang Chen, Tom Tong Jing, Lei He, Tianpei Zhang, Robi Dutta, Xianlong Hong
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