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MJ
2011
288views Multimedia» more  MJ 2011»
13 years 5 days ago
Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
Pablo Garcia Del Valle, David Atienza
RTAS
2008
IEEE
13 years 11 months ago
A Hybrid DVS Scheme for Interactive 3D Games
Interactive 3D games are now widely available on a variety of mobile devices for which battery-life is a major concern. Many of these devices support voltage/frequencyscalable pro...
Yan Gu, Samarjit Chakraborty
MICRO
2007
IEEE
150views Hardware» more  MICRO 2007»
13 years 11 months ago
Leveraging 3D Technology for Improved Reliability
Aggressive technology scaling over the years has helped improve processor performance but has caused a reduction in processor reliability. Shrinking transistor sizes and lower sup...
Niti Madan, Rajeev Balasubramonian