As CMOS feature sizes venture deep into the nanometer regime, wearout mechanisms including negative-bias temperature instability and timedependent dielectric breakdown can severely...
Shuguang Feng, Shantanu Gupta, Amin Ansari, Scott ...
Abstract—A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, highspeed interface to increase the device den...
Xiuyi Zhou, Jun Yang 0002, Yi Xu, Youtao Zhang, Ji...
Wireless networks are experiencing a paradigm shift from focusing on the traditional data transfer to accommodating the rapidly increasing multimedia traffic. Hence, their schedul...
Hongfei Du, Xiaozheng Huang, Jie Liang, Jiangchuan...
Power consumption is a primary concern for microprocessor designers. Lowering the supply voltage of processors is one of the most effective techniques for improving their energy e...
Timothy N. Miller, Renji Thomas, Xiang Pan, Radu T...
A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, high-speed interface to increase the device density and ...
Xiuyi Zhou, Yi Xu, Yu Du, Youtao Zhang, Jun Yang 0...