8 search results - page 1 / 2 » Using 3D integration technology to realize multi-context FPG... |
FPL
2009
Springer
13 years 9 months ago
2009
Springer
This paper advocates the use of 3D integration technology to stack a DRAM on top of an FPGA. The DRAM will store future FPGA contexts. A configuration is read from the DRAM into a...
GLVLSI
2009
IEEE
13 years 11 months ago
2009
IEEE
In this paper, we propose novel architectural and design techniques for three-dimensional field-programmable gate arrays (3D FPGAs) with Through-Silicon Vias (TSVs). We develop a...
IV
2005
IEEE
13 years 10 months ago
2005
IEEE
The visual analysis of time dependent data is an essential task in many application fields. However, visualizing large time dependent data collected within a spatial context is st...
ASPDAC
2007
ACM
13 years 8 months ago
2007
ACM
- 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...
3DIC
2009
IEEE
13 years 8 months ago
2009
IEEE
Abstract— Networks-on-chip (NoC) is emerging as a key onchip communication architecture for multiprocessor systemson-chip (MPSoC). In traditional electronic NoCs, high bandwidth ...