4 search results - page 1 / 1 » Yield-preferred via insertion based on novel geotopological ... |
ASPDAC
2006
ACM
13 years 11 months ago
2006
ACM
TCAD
2008
13 years 4 months ago
2008
As the technology node advances into the nanometer era, via-open defects are one of the dominant failures due to the copper cladding process. To improve via yield and reliability, ...
DAC
2006
ACM
14 years 6 months ago
2006
ACM
As the technology node advances into the nanometer era, via-open defects are one of the dominant failures. To improve via yield and reliability, redundant-via insertion is a highl...
ISVC
2009
Springer
13 years 11 months ago
2009
Springer
Abstract. In this paper, we propose a novel and fast method to localize and track needles during image-guided interventions. Our proposed method is comprised of framework of needle...