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ASPDAC
2006
ACM
13 years 11 months ago
2006
ACM
— The rapid increase in IC design complexity and wide-spread use of intellectual-property (IP) blocks have made the so-called mixed-size placement a very important topic in recen...
ASPDAC
2006
ACM
13 years 11 months ago
2006
ACM
Abstract— In the UDSM era, crosstalk is an area of considerable concern for designers, as it can have a considerable impact on the yield, both in terms of functionality and opera...
ASPDAC
2006
ACM
13 years 8 months ago
2006
ACM
Thermal effects are becoming increasingly important during integrated circuit design. Thermal characteristics influence reliability, power consumption, cooling costs, and performan...
ASPDAC
2006
ACM
13 years 11 months ago
2006
ACM
— Due to its great flexibility, gridless routing is desirable for nanometer circuit designs that use variable wire widths and spacings. Nevertheless, it is much more difficult ...
ISPD
2006
ACM
13 years 11 months ago
2006
ACM
The multilevel placement package mPL6 combines improved implementations of the global placer mPL5 (ISPD05) and the XDP legalizer and detailed placer (ASPDAC06). It consistently pr...