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ICCAD
2008
IEEE
14 years 1 months ago
2008
IEEE
—Increasing power densities due to process scaling, combined with high switching activity and poor cooling environments during testing, have the potential to result in high integ...
GLVLSI
2008
IEEE
13 years 6 months ago
2008
IEEE
TCAD
2008
13 years 4 months ago
2008
e the abstraction of signatures, this phenomenon ensures that CoR
DATE
2008
IEEE
13 years 11 months ago
2008
IEEE
DAC
2008
ACM
13 years 6 months ago
2008
ACM
level of accuracy in IC package abstraction (compact models) to ensure robust thermal design. An overarching goal must be to reduce power consumption per function through smart pro...