179 search results - page 35 / 36 » ics 2007 |
CORR
2007
Springer
13 years 5 months ago
2007
Springer
The expending development of wireless communication requires strong demands for components with improved capabilities. RF MEMS devices offer a variable alternative to conventional...
ICCAD
2007
IEEE
14 years 2 months ago
2007
IEEE
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
CODES
2007
IEEE
13 years 12 months ago
2007
IEEE
Multiple wireless technologies are converging to run on personal handhelds. The plethora of communication standards next to the cost issues of deeper submicron processing require ...
DATE
2007
IEEE
13 years 12 months ago
2007
IEEE
Everybody agrees that curing DFM/DFY issues is of paramount importance at 65 nanometers and beyond. Unfortunately, there is disagreement about how and when to cure them. “Surgeo...
DATE
2007
IEEE
13 years 12 months ago
2007
IEEE
Error-tolerance is an innovative way to enhance the effective yield of IC products. Previously a test methodology based on error-rate estimation to support error-tolerance was pro...