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ISQED
2006
IEEE
13 years 10 months ago
2006
IEEE
The increase in packing density has led to a higher power density in the chip which in turn has led to an increase in temperature on the chip. Temperature affects reliability, per...
ISQED
2006
IEEE
13 years 10 months ago
2006
IEEE
Design for Manufacturability (DFM) is becoming increasingly important as process geometries shrink. Conventional design rule pass/fail is not adequate to quantify DFM compliance. ...
ISQED
2006
IEEE
13 years 10 months ago
2006
IEEE
— With advanced VLSI manufacturing technology in deep submicron (DSM) regime, we can integrate entire electronic systems on a single chip (SoC). Due to the complexity in SoC desi...
ISQED
2006
IEEE
13 years 10 months ago
2006
IEEE
It is well known that fill insertion adversely affects total and coupling capacitance of interconnects. While grounded fill can be extracted by full-chip extractors, floating ...
ISQED
2006
IEEE
13 years 10 months ago
2006
IEEE
— In this paper, we propose an efficient model order reduction (MOR) algorithm, called MTermMOR, for modeling interconnect circuits with large number of external ports. The prop...