The development of a simplified analytical model to describe the thermal history of a Printed Circuit Board assembly (PCA) during convective reflow soldering is described in this ...
Nele Van Steenberge, Paresh Limaye, Geert Willems,...
CDM ESD event has become the main ESD reliability concern for integrated-circuits products using nanoscale CMOS technology. A novel CDM ESD protection design, using self-biased cu...