DLOG
2003
13 years 6 months ago
2003
In this paper, we investigate the use of Description Logic (DL) for representing Product Behavioral constraints in Computer Aided Design (CAD) Systems. In an integrated design app...
SEDE
2007
13 years 6 months ago
2007
— Achieving reliability in fault tolerant systems requires both avoidance and redundancy. This study focuses on avoidance as it pertains to the design of microchips. The lifecycl...
AGTIVE
2003
Springer
13 years 9 months ago
2003
Springer
Abstract. This paper deals with knowledge-based computer aided design. A novel method giving additional support for conceptual design is presented. In this method, a designer firs...
DATE
2006
IEEE
13 years 10 months ago
2006
IEEE
The problem of diagnosis – or locating the source of an error or fault – occurs in several areas of Computer Aided Design, such as dynamic verification, property checking, eq...
VLSID
2009
IEEE
14 years 5 months ago
2009
IEEE
The current paradigm of using Cu interconnects for on-chip global communication is rapidly becoming a serious performance bottleneck in ultra-deep submicron (UDSM) technologies. C...
VLSID
2009
IEEE
14 years 5 months ago
2009
IEEE
We propose a novel dependable SRAM with 7T cells and their array structure that avoids a half-selection problem. In addition, we introduce a new concept, "quality of a bit (Q...
VLSID
2009
IEEE
14 years 5 months ago
2009
IEEE
Increasing the number of cores in a multi-core processor reduces per-core performance. On the other hand, providing more resources to each core limits the number of cores on a chi...
VLSID
2009
IEEE
14 years 5 months ago
2009
IEEE
Power density has been increasing at an alarming rate in recent processor generations resulting in high on-chip temperature. Higher temperature results in poor reliability and inc...
VLSID
2009
IEEE
14 years 5 months ago
2009
IEEE
VLSID
2009
IEEE
14 years 5 months ago
2009
IEEE
Abstract-- Single-ended static random access memory (SESRAM) is well known for their tremendous potential of low active power and leakage dissipations. In this paper, we present a ...