DATE
2004
IEEE
14 years 1 months ago
2004
IEEE
When an application or external environmental conditions cause a chip's cooling capacity to be exceeded, dynamic thermal management (DTM) dynamically reduces the power densit...
DAC
2009
ACM
14 years 10 months ago
2009
ACM
Exponentially rising cooling/packaging costs due to high power density call for architectural and software-level thermal management. Dynamic thermal management (DTM) techniques co...