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    DAC
    2007
    ACM
    142views Computer Architecture» more  DAC 2007»
    Placement of 3D ICs with Thermal and Interlayer Via Considerations
    14 years 10 months ago
    Placement of 3D ICs with Thermal and Interlayer Via Considerations
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    Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
    Brent Goplen, Sachin S. Sapatnekar
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