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    DAC
    2007
    ACM
    142views Computer Architecture» more  DAC 2007»
    Placement of 3D ICs with Thermal and Interlayer Via Considerations
    14 years 6 months ago
    Placement of 3D ICs with Thermal and Interlayer Via Considerations
    Download  www.ece.umn.edu
    Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
    Brent Goplen, Sachin S. Sapatnekar
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