TCAD
2002
13 years 4 months ago
2002
Chemical-mechanical polishing (CMP) and other manufacturing steps in very deep submicron VLSI have varying effects on device and interconnect features, depending on local character...
DAC
2003
ACM
14 years 6 months ago
2003
ACM
Chemical-mechanical planarization (CMP) and other manufacturing steps in very deep-submicron VLSI have varying effects on device and interconnect features, depending on the local ...
DAC
2000
ACM
14 years 6 months ago
2000
ACM
We propose practical iterated methods for layout density control for CMP uniformity, based on linear programming, Monte-Carlo and greedy algorithms. We experimentally study the tr...