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    GLVLSI
    2005
    IEEE
    120views VLSI» more  GLVLSI 2005»
    3D module placement for congestion and power noise reduction
    13 years 10 months ago
    3D module placement for congestion and power noise reduction
    Download  www.gtcad.gatech.edu
    3D packaging via System-On-Package (SOP) is a viable alternative to System-On-Chip (SOC) to meet the rigorous requirements of today’s mixed signal system integration. In this wo...
    Jacob R. Minz, Sung Kyu Lim, Cheng-Kok Koh
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