MR 2007 | Sciweavers

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MR
2007

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A comprehensive model for PMOS NBTI degradation: Recent progress

13 years 4 months ago

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Muhammad Ashraful Alam, Haldun Kufluoglu, D. Vargh...

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MR
2007

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Active ESD protection circuit design against charged-device-model ESD event in CMOS integrated circuits

13 years 4 months ago

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CDM ESD event has become the main ESD reliability concern for integrated-circuits products using nanoscale CMOS technology. A novel CDM ESD protection design, using self-biased cu...

Shih-Hung Chen, Ming-Dou Ker

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MR
2007

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Trench IGBT failure mechanisms evolution with temperature and gate resistance under various short-circuit conditions

13 years 4 months ago

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Two extreme configurations under short circuit conditions leading to the punch through Trench IGBT failure under the effect of the temperature and the gate resistance have been st...

A. Benmansour, Stephane Azzopardi, J. C. Martin, E...

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MR
2007

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Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly

13 years 4 months ago

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The development of a simplified analytical model to describe the thermal history of a Printed Circuit Board assembly (PCA) during convective reflow soldering is described in this ...

Nele Van Steenberge, Paresh Limaye, Geert Willems,...

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