ICCAD
2003
IEEE
14 years 1 months ago
2003
IEEE
In this paper, we propose a novel framework for fast multilevel routing considering crosstalk and performance optimization. To handle the crosstalk minimization problem, we incorp...
ICCAD
2005
IEEE
14 years 1 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
DAC
2005
ACM
14 years 5 months ago
2005
ACM
As technology advances into the nanometer territory, the interconnect delay has become a first-order effect on chip performance. To handle this effect, the X-architecture has been...