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ICCAD
2003
IEEE
147views Hardware» more  ICCAD 2003»
12 years 10 months ago
A Fast Crosstalk- and Performance-Driven Multilevel Routing System
In this paper, we propose a novel framework for fast multilevel routing considering crosstalk and performance optimization. To handle the crosstalk minimization problem, we incorp...
Tsung-Yi Ho, Yao-Wen Chang, Sao-Jie Chen, D. T. Le...
ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
12 years 10 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
DAC
2005
ACM
13 years 2 months ago
Multilevel full-chip routing for the X-based architecture
As technology advances into the nanometer territory, the interconnect delay has become a first-order effect on chip performance. To handle this effect, the X-architecture has been...
Tsung-Yi Ho, Chen-Feng Chang, Yao-Wen Chang, Sao-J...
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