ICCAD
1990
IEEE
13 years 9 months ago
1990
IEEE
We present a hierarchicaltechniquefor floorplanning and pin assignment of the general cell layouts. Given a set of cells with their shape lists, a layout aspect ratio, relative po...
SLIP
2009
ACM
13 years 11 months ago
2009
ACM
As technology advances, 3D ICs are introduced for alleviating the interconnect problem coming with shrinking feature size and increasing integration density. In 3D ICs, one of the...