DATE
2004
IEEE
13 years 8 months ago
2004
IEEE
In this paper, we study the net and pin distribution problem for global routing targeting three dimensional packaging layout via System-on-Package (SOP). The routing environment f...
ASPDAC
2004
ACM
13 years 10 months ago
2004
ACM
—The routing environment for the new emerging mixed-signal System-on-Package (SOP) technology is more advanced than that of the conventional PCB or MCM technology – pins are lo...