DATE
2004
IEEE
13 years 8 months ago
2004
IEEE
With the increasing power density and heat-dissipation cost of modern VLSI designs, thermal and power integrity has become serious concern. Although the impacts of thermal effects...
ICCAD
2001
IEEE
14 years 1 months ago
2001
IEEE
This paper presents both compact analytical models and fast SPICE based 3-D electro-thermal simulation methodology to characterize thermal effects due to Joule heating in high per...