Thermal and Power Integrity Based Power/Ground Networks Optimization

With the increasing power density and heat-dissipation cost of modern VLSI designs, thermal and power integrity has become serious concern. Although the impacts of thermal effects on transistor and interconnect performance are well-studied, the interactions between power-delivery and thermal effects are not clear. As a result, power-delivery design without thermal consideration may cause soft-error, reliability degradation, and even premature chip failures. In this paper, we propose a thermalaware power-delivery optimization algorithm. By simultaneously considering thermal and power integrity, we are able to achieve high power supply quality and thermal reliability. For a 58

• Type: Conference
• Year: 2004
• Where: DATE
• Authors: Ting-Yuan Wang, Jeng-Liang Tsai, Charlie Chung-Ping Chen
• Keywords: DATE 2004, Hardware, Power Integrity, Thermal, Thermal Effects