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ISCAS
2006
IEEE
112views Hardware» more  ISCAS 2006»
9 years 4 months ago
Fine-grain thermal profiling and sensor insertion for FPGAs
– Increasing logic densities and clock frequencies on FPGAs lead to rapid increase in power density, which translates to higher on-chip temperature. In this paper, we investigate...
Somsubhra Mondal, Rajarshi Mukherjee, Seda Ogrenci...
ICCAD
2006
IEEE
149views Hardware» more  ICCAD 2006»
9 years 7 months ago
Thermal sensor allocation and placement for reconfigurable systems
Temperature monitoring using thermal sensors is an essential tool for evaluating the thermal behavior and sustaining the reliable operation in high-performance and high-power syst...
Rajarshi Mukherjee, Somsubhra Mondal, Seda Ogrenci...
DAC
2009
ACM
9 years 11 months ago
Spectral techniques for high-resolution thermal characterization with limited sensor data
Elevated chip temperatures are true limiters to the scalability of computing systems. Excessive runtime thermal variations compromise the performance and reliability of integrated...
Ryan Cochran, Sherief Reda
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