ISPD
2003
ACM
13 years 10 months ago
2003
ACM
Floorplanning individual pipelined array modules of a larger overall die can yield beneficial results. Critical paths in every pipeline stage of a pipelined design are roughly equ...
ASPDAC
2005
ACM
13 years 10 months ago
2005
ACM
— The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wirelength. However, wire congestion and thermal issues are exacerbated d...