Electrical and Thermal Analysis for System-in-a-Package (SiP) Implementation Platform

This paper presents an electrical and thermal performance analysis of System-in-a-Package (SiP) memory/logic implementation platform based on ChipLaminate-Chip (CLC) technology. Internal IO interface inside CLC module has been modeled and compared with Stack-Chip (SC) implementation. Thermal analysis, including comparison against Stack-Chip and System-ona-Chip (SoC) is also presented. It is demonstrated that CLC technology provides significant performance advantage over conventional SiP technologies and has great impact on future system-level integration.

• Type: Conference
• Year: 2003
• Where: ISQED
• Authors: Michael X. Wang, Katsuharu Suzuki, Wayne Wei-Ming Dai
• Keywords: CLC Module, CLC Technology, Hardware, ISQED 2003, Thermal Performance Analysis