Electromagnetic interaction of on-chip antennas and CMOS metal layers for wireless IC interconnects

The electromagnetic interaction of on-chip antennas and metal interconnects modeled in a 250 nm complementary metal-oxide semiconductor (CMOS) technology is investigated. A finite element method (FEM) based 3-D full-wave solver is used to perform the electromagnetic field analysis. It is shown that there can be significant signal coupling between the on-chip transmitting antenna and the metal in

• Type: Conference
• Year: 2010
• Where: GLVLSI
• Authors: Ankit More, Baris Taskin
• Keywords: Electromagnetic Field Analysis, GLVLSI 2010, On-chip Antennas, On-chip Transmitting Antenna, VLSI