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2003
IEEE

Electrical and Thermal Analysis for System-in-a-Package (SiP) Implementation Platform

10 years 3 months ago
Electrical and Thermal Analysis for System-in-a-Package (SiP) Implementation Platform
This paper presents an electrical and thermal performance analysis of System-in-a-Package (SiP) memory/logic implementation platform based on ChipLaminate-Chip (CLC) technology. Internal IO interface inside CLC module has been modeled and compared with Stack-Chip (SC) implementation. Thermal analysis, including comparison against Stack-Chip and System-ona-Chip (SoC) is also presented. It is demonstrated that CLC technology provides significant performance advantage over conventional SiP technologies and has great impact on future system-level integration.
Michael X. Wang, Katsuharu Suzuki, Wayne Wei-Ming
Added 04 Jul 2010
Updated 04 Jul 2010
Type Conference
Year 2003
Where ISQED
Authors Michael X. Wang, Katsuharu Suzuki, Wayne Wei-Ming Dai
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