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GLVLSI
2010
IEEE

Electromagnetic interaction of on-chip antennas and CMOS metal layers for wireless IC interconnects

10 years 6 months ago
Electromagnetic interaction of on-chip antennas and CMOS metal layers for wireless IC interconnects
The electromagnetic interaction of on-chip antennas and metal interconnects modeled in a 250 nm complementary metal-oxide semiconductor (CMOS) technology is investigated. A finite element method (FEM) based 3-D full-wave solver is used to perform the electromagnetic field analysis. It is shown that there can be significant signal coupling between the on-chip transmitting antenna and the metal in
Ankit More, Baris Taskin
Added 02 Aug 2010
Updated 02 Aug 2010
Type Conference
Year 2010
Where GLVLSI
Authors Ankit More, Baris Taskin
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