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3DIC
2009
IEEE
178views Hardware» more  3DIC 2009»
13 years 8 months ago
Investigation and comparison of thermal distribution in synchronous and asynchronous 3D ICs
This paper presents an analysis and comparison between synchronous and delay-insensitive asynchronous logic circuits on thermal distributions for investigating novel solutions to t...
Brent Hollosi, Tao Zhang, Ravi Sankar Parameswaran...
GLVLSI
2006
IEEE
115views VLSI» more  GLVLSI 2006»
13 years 11 months ago
Yield enhancement of asynchronous logic circuits through 3-dimensional integration technology
This paper presents a systematic design methodology for yield enhancement of asynchronous logic circuits using 3-D (3-Dimensional) integration technology. In this design, the targ...
Song Peng, Rajit Manohar