A 3D circuit is the stacking of regular 2D circuits. The advances on the fabrication and packaging technologies allowed interconnecting stacked 2D circuits by using 3D vias. Howeve...
Sandro Sawicki, Gustavo Wilke, Marcelo O. Johann, ...
In this paper, we propose novel architectural and design techniques for three-dimensional field-programmable gate arrays (3D FPGAs) with Through-Silicon Vias (TSVs). We develop a...
We present the design of high-performance and energy-efficient dynamic instruction schedulers in a 3-Dimensional integration technology. Based on a previous observation that the c...
The sustained progress of VLSI technology has altered the landscape of routing which is a major physical design stage. For timing driven routings, traditional approaches which con...