6 search results - page 1 / 2 » A New Surface Integral Formulation For Wideband Impedance Ex... |
ICCAD
2003
IEEE
14 years 1 months ago
2003
IEEE
Detailed electromagnetic analysis of three-dimensional structures in multilayered dielectric media is critical for automatic generation of equivalent circuit models for the interc...
DAC
1998
ACM
14 years 5 months ago
1998
ACM
As VLSI circuit speeds have increased, reliable chip and system design can no longer be performed without accurate threedimensional interconnect models. In this paper, we describe...
ISCAS
2006
IEEE
13 years 11 months ago
2006
IEEE
As the operation frequency reaches gigahertz in very deep-submicron designs, the effect of on-chip inductance on circuit performance can no longer be neglected. Therefore, it is d...
CGF
2002
13 years 4 months ago
2002
Three-dimensional (3D) image acquisition systems are rapidly becoming more affordable, especially systems based on commodity electronic cameras. At the same time, personal compute...
DAC
2005
ACM
14 years 5 months ago
2005
ACM
Existing Full-wave Model Order Reduction (FMOR) approaches are based on Expanded Taylor Series Approximations (ETAS) of the oscillatory full-wave system matrix. The accuracy of su...