: The distributed recovery block (DRB) scheme is a widely applicable approach for realizing both hardware and software fault tolerance in real-time distributed and parallel compute...
Reconfigurable architectures are becoming increasingly popular with space related design engineers as they are inherently flexible to meet multiple requirements and offer signific...
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
—When manufacturing nano-devices, defects are a certainty and reliability becomes a critical issue. Until now, the most pervasive methods used to address reliability, involve inj...
As manufacturing technology enters the ultra-deep submicron era, wafer yields are destined to drop due to higher occurrence of physical defects on the die. This paper proposes a y...
Nicola Campregher, Peter Y. K. Cheung, George A. C...