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» A high throughput 3D-bus interconnect for network processors
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IPPS
2006
IEEE
13 years 11 months ago
Performance evaluation of wormhole routed network processor-memory interconnects
Network line cards are experiencing ever increasing line rates, random data bursts, and limited space. Hence, they are more vulnerable than other processormemory environments, to ...
Taskin Koçak, Jacob Engel
ICCD
2006
IEEE
275views Hardware» more  ICCD 2006»
14 years 2 months ago
Split-Row: A Reduced Complexity, High Throughput LDPC Decoder Architecture
— A reduced complexity LDPC decoding method is presented that dramatically reduces wire interconnect complexity, which is a major issue in LDPC decoders. The proposed Split-Row m...
Tinoosh Mohsenin, Bevan M. Baas
FPL
2008
Springer
116views Hardware» more  FPL 2008»
13 years 6 months ago
NOC architecture design for multi-cluster chips
For the next generation of multi-core processors, the onchip interconnection networks must be efficient to achieve high data throughput and performance. Moreover, these interconne...
Henrique C. Freitas, Philippe Olivier Alexandre Na...
ICPPW
2005
IEEE
13 years 11 months ago
Performance Evaluation of High-Speed Interconnects Using Dense Communication Patterns
We study the performance of high-speed interconnects using a set of communication micro-benchmarks. The goal is to identify certain limiting factors and bottlenecks with these int...
Rod Fatoohi, Ken Kardys, Sumy Koshy, Soundarya Siv...
VLDB
1995
ACM
179views Database» more  VLDB 1995»
13 years 8 months ago
The ClustRa Telecom Database: High Availability, High Throughput, and Real-Time Response
New telecommunication services and mobility networks have introduced databases in telecommunication networks. Compared with traditional use of databases, telecom databases must fu...
Svein-Olaf Hvasshovd, Øystein Torbjø...