24 search results - page 4 / 5 » A low-radix and low-diameter 3D interconnection network desi... |
SLIP
2009
ACM
14 years 15 days ago
2009
ACM
As technology advances, 3D ICs are introduced for alleviating the interconnect problem coming with shrinking feature size and increasing integration density. In 3D ICs, one of the...
TPDS
1998
13 years 5 months ago
1998
—Three-dimensional packaging technologies are critical for enabling ultra-compact, massively parallel processors (MPPs) for embedded applications. Through-wafer optical interconn...
ICCAD
2004
IEEE
14 years 2 months ago
2004
IEEE
As the technology progresses, interconnect delays have become bottlenecks of chip performance. Three dimensional (3D) integrated circuits are proposed as one way to address this p...
INFOCOM
2009
IEEE
14 years 19 days ago
2009
IEEE
Abstract— The goal of data center networking is to interconnect a large number of server machines with low equipment cost, high and balanced network capacity, and robustness to l...
NOCS
2009
IEEE
14 years 21 days ago
2009
IEEE
Communication plays a crucial role in the design and performance of multi-core systems-on-chip (SoCs). Networks-on-chip (NoCs) have been proposed as a promising solution to simpli...