25 search results - page 2 / 5 » A methodology for 3D electronic institutions |
DATE
1997
IEEE
13 years 9 months ago
1997
IEEE
An efficient method for the analysis of real 3D conjugate heat transfer for electronic devices is presented. This methodology is based on the coupling of two software : a conducti...
ISCAS
2006
IEEE
2006
IEEE
Microelectromechanical systems in 3D SOI-CMOS: sensing electronics embedded in mechanical structures
13 years 11 months ago
— We discuss the design of CMOS MEMS in a 3D SOI-CMOS technology. We present layout architectures, preliminary mechanics modeling using finite element analysis and release proce...
ATAL
2009
Springer
13 years 9 months ago
2009
Springer
Virtual Institutions are Virtual Worlds with normative regulation of participants’ interactions. This paradigm is based on normative multiagent systems and is technologically su...
CHI
2005
ACM
14 years 5 months ago
2005
ACM
The importance of annotations, as a by-product of the reading activity, cannot be overstated. Annotations help users in the process of analyzing, re-reading, and recalling detaile...
ISPD
2011
ACM
12 years 7 months ago
2011
ACM
Three-dimensional ICs promise to significantly extend the scale of system integration and facilitate new-generation electronics. However, progress in commercial 3D ICs has been s...