11 search results - page 1 / 3 » A novel framework for multilevel full-chip gridless routing |
TCAD
2008
13 years 5 months ago
2008
As the technology node advances into the nanometer era, via-open defects are one of the dominant failures due to the copper cladding process. To improve via yield and reliability, ...
ICCAD
2001
IEEE
14 years 2 months ago
2001
IEEE
ASPDAC
2006
ACM
13 years 11 months ago
2006
ACM
— Due to its great flexibility, gridless routing is desirable for nanometer circuit designs that use variable wire widths and spacings. Nevertheless, it is much more difficult ...
DATE
2004
IEEE
13 years 9 months ago
2004
IEEE
Conventional physical design flow separates the design of power network and signal network. Such a separated approach results in slow design convergence for wire-limited deep sub-...
DAC
2006
ACM
14 years 6 months ago
2006
ACM
As the technology node advances into the nanometer era, via-open defects are one of the dominant failures. To improve via yield and reliability, redundant-via insertion is a highl...