19 search results - page 3 / 4 » A robust detailed placement for mixed-size IC designs |
DAC
2008
ACM
13 years 7 months ago
2008
ACM
level of accuracy in IC package abstraction (compact models) to ensure robust thermal design. An overarching goal must be to reduce power consumption per function through smart pro...
ASPDAC
2008
ACM
13 years 7 months ago
2008
ACM
Traditionally, clock network layout is performed after cell placement. Such methodology is facing a serious problem in nanometer IC designs where people tend to use huge clock buff...
VLSID
2010
IEEE
13 years 4 months ago
2010
IEEE
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...
DSN
2011
IEEE
12 years 5 months ago
2011
IEEE
—Virtualization offers the potential for cost-effective service provisioning. For service providers who make significant investments in new virtualized data centers in support of...
FTEDA
2006
13 years 5 months ago
2006
As IC technologies scale to finer feature sizes, it becomes increasingly difficult to control the relative process variations. The increasing fluctuations in manufacturing process...