31 search results - page 1 / 7 » Adaptive chip-package thermal analysis for synthesis and des... |
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
Abstract— Chip-package thermal analysis is necessary for the design and synthesis of reliable, high-performance, low-power, compact integrated circuits (ICs). Many methods of IC ...
DATE
2006
IEEE
13 years 11 months ago
2006
IEEE
Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
ISLPED
2009
ACM
13 years 11 months ago
2009
ACM
This paper presents an evaluation to determine the importance of the accurate thermal characterization for several elements of a semiconductor device. Specifically, it evaluates ...
DATE
2010
IEEE
13 years 10 months ago
2010
IEEE
—Temperature has a strong influence on integrated circuit (IC) performance, power consumption, and reliability. However, accurate thermal analysis can impose high computation co...
VLSID
2009
IEEE
14 years 5 months ago
2009
IEEE
: The challenges in nano-CMOS circuit design include the following: variability, leakage, power, thermals, reliability, and yield. This talk will focus on interdependent considerat...