24 search results - page 4 / 5 » Adaptive multi-domain thermal modeling and analysis for inte... |
DAC
2010
ACM
13 years 7 months ago
2010
ACM
In this study, we propose the use of specialized influence models to capture the dynamic behavior of a Network-onChip (NoC). Our goal is to construct a versatile modeling framewor...
ICCAD
2002
IEEE
14 years 2 months ago
2002
IEEE
As the scale of system integration continues to grow, the on-chip communication becomes the ultimate bottleneck of system performance and the primary determinant of system archite...
TVLSI
2010
13 years 21 days ago
2010
Abstract-- The operational characteristics of integrated circuits based on nanoscale semiconductor technology are expected to be increasingly affected by variations in the manufact...
DAC
2010
ACM
13 years 10 months ago
2010
ACM
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
DAC
2005
ACM
14 years 7 months ago
2005
ACM
MiniBit, our automated approach for optimizing bit-widths of fixed-point designs is based on static analysis via affine arithmetic. We describe methods to minimize both the intege...