22 search results - page 4 / 5 » An accurate interconnect thermal model using equivalent tran... |
3DIC
2009
IEEE
14 years 4 days ago
2009
IEEE
Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
SLIP
2009
ACM
13 years 12 months ago
2009
ACM
Different interconnection structures have been proposed to solve the performance limitation caused by scaling of on-chip global wires. In this paper, we give an overview of curre...
ICCAD
1999
IEEE
13 years 9 months ago
1999
IEEE
Krylov-subspace based methods for generating low-order models of complicated interconnect are extremely effective, but there is no optimality theory for the resulting models. Alte...
VLSID
2002
IEEE
14 years 5 months ago
2002
IEEE
The improved T and improved n models are proposed for onchip interconnect macromodeling. Using global approximations, simple approximation frames are derived and applied to modeli...
DAC
2008
ACM
14 years 6 months ago
2008
ACM
A low power passive equalizer using RL terminator is proposed and optimized in this work. The equalizer includes an inductor in series with the resistive terminator, which boosts ...