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ISLPED
2007
ACM
138views Hardware» more  ISLPED 2007»
13 years 6 months ago
Power optimal MTCMOS repeater insertion for global buses
This paper addresses the problem of power-optimal repeater insertion for global buses in the presence of crosstalk noise. MTCMOS technique by inserting high-Vth sleep transistors ...
Hanif Fatemi, Behnam Amelifard, Massoud Pedram
ICCAD
1994
IEEE
76views Hardware» more  ICCAD 1994»
13 years 9 months ago
Simultaneous functional-unit binding and floorplanning
As device feature size decreases, interconnection delay becomes the dominating factor of system performance. Thus it is important that accurate physical information is used during...
Yung-Ming Fang, D. F. Wong
DATE
2003
IEEE
76views Hardware» more  DATE 2003»
13 years 10 months ago
Modeling and Evaluation of Substrate Noise Induced by Interconnects
Interconnects have deserved attention as a source of crosstalk to other interconnects, but have been ignored as a source of substrate noise. In this paper, we evaluate the importa...
Ferran Martorell, Diego Mateo, Xavier Aragon&egrav...
ISLPED
2003
ACM
142views Hardware» more  ISLPED 2003»
13 years 10 months ago
Minimization of dynamic and static power through joint assignment of threshold voltages and sizing optimization
We describe an optimization strategy for minimizing total power consumption using dual threshold voltage (Vth) technology. Significant power savings are possible by simultaneous a...
David Nguyen, Abhijit Davare, Michael Orshansky, D...
ISQED
2009
IEEE
94views Hardware» more  ISQED 2009»
13 years 11 months ago
Simultaneous buffer and interlayer via planning for 3D floorplanning
As technology advances, the interconnect delay among modules plays dominant role in chip performance. Buffer insertion, as a traditional approach to reduce wire delay in 2D ICs, i...
Xu He, Sheqin Dong, Yuchun Ma, Xianlong Hong